AQUEOUS BONDING COMPOSITION

Disclosed is an aqueous bonding composition comprises: (A) a saccharide; (B) an inorganic acid ammonium salt; and (C) a metal salt, wherein the metal salt (C) comprises at least one selected from potassium salts, calcium salts, sodium salts, and magnesium salts. The aqueous bonding composition is ex...

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Bibliographic Details
Main Authors YOSHIDA, Yoshio, KAKUDA, Atsushi
Format Patent
LanguageEnglish
French
German
Published 13.06.2018
Subjects
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Summary:Disclosed is an aqueous bonding composition comprises: (A) a saccharide; (B) an inorganic acid ammonium salt; and (C) a metal salt, wherein the metal salt (C) comprises at least one selected from potassium salts, calcium salts, sodium salts, and magnesium salts. The aqueous bonding composition is excellent in balance among bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength. The aqueous bonding composition can be usefully used to produce a wood-based material. Further, a wood-based material obtainable by using the aqueous bonding composition is provided.
Bibliography:Application Number: EP20160754571