LED FABRICATION USING HIGH-REFRACTIVE-INDEX ADHESIVES

Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contamina...

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Bibliographic Details
Main Authors VAN LETH, Nicolaas Joseph Martin, SCHRICKER, April Dawn, ROITMAN, Daniel
Format Patent
LanguageEnglish
French
German
Published 18.04.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contaminant-free and debris-free adhesion between surfaces. LED apparatus designed and manufactured such that surfaces to be bonded together are prepared in a manner that facilitates use of high-refractive-index adhesives. A multi-step process involving two different concentrations of a catalyst is performed so as to fabricate highly-reliable, non-browning, and non-cracking high-refractive-index adhesives for light-emitting diode component fabrication.
Bibliography:Application Number: EP20160730172