SEMICONDUCTOR DIE FOR USE IN DIFFERENT PACKAGE TYPES

• Main Authors: Jans, Thierry, Yeung, Shun Tik, Walcyzk, Sven, Horstink, Harrie Martinus Maria, Umali, Pompeo V, Leung, Chi Ho, Lam, Kan Wae
• Format: Patent
• Language: English; French; German
• Published: 11.04.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor die has internal circuitry formed on two more internal layers, and die bonding pads arranged on a top surface of the die. The bonding pads are connected to the internal circuitry for providing input and output signals to the internal circuitry. One or more connecting lines electrical...