SEMICONDUCTOR DIE FOR USE IN DIFFERENT PACKAGE TYPES

A semiconductor die has internal circuitry formed on two more internal layers, and die bonding pads arranged on a top surface of the die. The bonding pads are connected to the internal circuitry for providing input and output signals to the internal circuitry. One or more connecting lines electrical...

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Bibliographic Details
Main Authors Jans, Thierry, Yeung, Shun Tik, Walcyzk, Sven, Horstink, Harrie Martinus Maria, Umali, Pompeo V, Leung, Chi Ho, Lam, Kan Wae
Format Patent
LanguageEnglish
French
German
Published 11.04.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor die has internal circuitry formed on two more internal layers, and die bonding pads arranged on a top surface of the die. The bonding pads are connected to the internal circuitry for providing input and output signals to the internal circuitry. One or more connecting lines electrically connect one or more pairs of the die bonding pads, thereby defining a bonding pad layout. The die bonding pads are arranged and connected with the connecting lines such that the bonding pad layout is reversible, which allows the die to be used in different package types (e.g., TSSOP or DFN) yet maintain a standardized pin arrangement without the necessity for long or crossed bond wires.
Bibliography:Application Number: EP20170184817