INTEGRATED CIRCUIT WITH SENSOR PRINTED IN SITU

The present disclosure teaches a method for manufacturing a module comprising an integrated circuit and a sensor. The method may comprise: mounting an integrated circuit (IC) die on a printed circuit board (PCB) using a high temperature process to provide an electrical connection between interconnec...

Full description

Saved in:
Bibliographic Details
Main Authors ECK, Arthur B, YACH, Randy L
Format Patent
LanguageEnglish
French
German
Published 11.04.2018
Subjects
ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS
MEASURING
MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE
MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
PHYSICS
TARIFF METERING APPARATUS
TESTING
Online AccessGet full text

Cover

More Information
Summary:The present disclosure teaches a method for manufacturing a module comprising an integrated circuit and a sensor. The method may comprise: mounting an integrated circuit (IC) die on a printed circuit board (PCB) using a high temperature process to provide an electrical connection between interconnects of the PCB and the die; and printing a sensor directly onto the module after all high temperature mounting processes are complete.
Bibliography:Application Number: EP20160730135