LIGHT EMITTING DIODE PACKAGE AND LIGHTING DEVICE

• Main Authors: SEO, Jae Won, YIM, Bum Jin, KIM, Hoe Jun, HONG, Jun Hee
• Format: Patent
• Language: English; French; German
• Published: 31.01.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A light emitting diode package, according to an embodiment, comprises: a substrate; a light emitting structure that is disposed below the substrate and includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first bonding pad connected with the first conductive type semiconductor layer while being embedded in a through-hole formed through the active layer and the second conductive type semiconductor layer, the first conductive type semiconductor layer being exposed through the through-hol; a second bonding pad that is disposed below the second conductive type semiconductor layer while being spaced apart from the first bonding pad and is connected with the second conductive type semiconductor layer; a first insulation layer disposed on the lateral portion of the light emitting structure and on the lower inner edge of the light emitting structure in the through-hole; and a second insulation layer disposed between the first insulation layer and the first bonding pad in the through-hole.