COVERING MATERIAL FOR ADHESIVE HOT-MELT GLUES

• Main Authors: DAVIS, Riju, KOSTYRA, Sebastian, PETRY, Gerald, PÜRKNER, Eckhard, HEEMANN, Marcus
• Format: Patent
• Language: English; French; German
• Published: 25.08.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; GENERAL PROCESSES OF COMPOUNDING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; MAKING GRANULES OR PREFORMS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

The invention relates to a nontacky film-forming polymer composition (cover material), and tacky hot melt adhesives in the form of pellets which are coated with the polymer composition and producible by coextruding the hot melt adhesive and the cover material. The film-forming composition comprises 5 to 40% by weight of at least one Fischer-Tropsch wax having a melting point of >95° C. and 30 to 70% by weight of at least one metallocene-catalyzed polyolefin having a softening point of >95° C. and a melt flow index (MFI) (230° C., 2.16 kg) of ≤1000 and ≥300 g/10 minutes. The invention further relates to suitable uses for such hot melt adhesives, methods for their use, and products containing these adhesives.