ELECTROMAGNETICALLY SHIELDED SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface...

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Bibliographic Details
Main Authors KO, Young-dae, BEAK, O-hyun, MUN, Il-ju, KUK, Keon, HAN, Eun-bong, JUNG, Yeon-kyoung, KIM, Hyeon-hyang
Format Patent
LanguageEnglish
French
German
Published 08.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.
Bibliography:Application Number: EP20160761926