MICROELECTRONIC INTERCONNECT ADAPTOR

An interconnect adaptor may be fabricated having a substantially planar surface, to which a microelectronic package may be electrically attached, and a non-planar surface with at least one interconnect extending from the interconnect adaptor planar surface to the interconnect adaptor non-planar surf...

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Bibliographic Details
Main Authors GEISSLER, Christian, REINGRUBER, Klaus, ALBERS, Sven
Format Patent
LanguageEnglish
French
German
Published 29.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An interconnect adaptor may be fabricated having a substantially planar surface, to which a microelectronic package may be electrically attached, and a non-planar surface with at least one interconnect extending from the interconnect adaptor planar surface to the interconnect adaptor non-planar surface. The interconnect adaptor non-planar surface may be shaped to substantially conform to a shape of a microelectronic substrate to which it may be attached, which eliminates the need to bend or otherwise adapt the microelectronic package to conform to the microelectronic substrate.
Bibliography:Application Number: EP20160752859