SEMICONDUCTOR PACKAGE WITH DIES POSITIONED SIDE BY SIDE

A semiconductor package for a side by side die configuration may include a substrate having a cavity, a bridge interposer positioned within the cavity and having an active side facing active sides of a first die and a second die and partially horizontally overlapping the first die and the second die...

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Bibliographic Details
Main Authors KIM, Chin-Kwan, SYED, Ahmer, Raza, BCHIR, Omar, James, LANE, Ryan, David, SHAH, Milind, Pravin
Format Patent
LanguageEnglish
French
German
Published 23.02.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package for a side by side die configuration may include a substrate having a cavity, a bridge interposer positioned within the cavity and having an active side facing active sides of a first die and a second die and partially horizontally overlapping the first die and the second die to provide an interconnection between the first die and the second die, and a thermal element attached to backsides of the first die and the second die to provide a heat path and heat storage for the first die and the second die.
Bibliography:Application Number: EP20160704113