HOT MELT ADHESIVE COMPOSITIONS THAT INCLUDE ETHYLENE COPOLYMER

The invention is directed to hot melt adhesive compositions that include one or more ethylene based copolymers, no greater than about 27% by weight of a tackifying agent and a wax.

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Bibliographic Details
Main Authors SCHMIDT, Scott C, KAUFFMAN, Thomas F
Format Patent
LanguageEnglish
French
German
Published 13.12.2017
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The invention is directed to hot melt adhesive compositions that include one or more ethylene based copolymers, no greater than about 27% by weight of a tackifying agent and a wax.
Bibliography:Application Number: EP20160706093