ELECTRONIC DEVICE MODULE

• Main Authors: BIJLEVELD, Erik Cornelis, KUIJK, Egbert Willem
• Format: Patent
• Language: English; French; German
• Published: 29.11.2017
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention relates to an electronic device module comprising a glass cover sheet 1, a polymeric front polymeric material 2, an electronic device 3, a polymeric back material 4 and a backsheet 5, wherein the polymeric front and/or back materials have a trilayer structure comprising a back layer (23, 43) which is adhered to a surface of the electronic device 3, a front layer (21, 41) which is adhered to the glass cover sheet 1 or the backsheet 5 and an intermediate layer (22, 42) between the back layer and the front layer, wherein each of the back layer and the front layer comprises an ethylene interpolymer grafted with silane, wherein the ethylene interpolymer grafted with silane has a density of at most 0.905 g/cm 3 , and the intermediate layer comprises a non-grafted ethylene interpolymer having a density of at most 0.905 g/cm 3 , which is crosslinked with the aid of a crosslinking initiator and optionally a crosslinking coagent.