APPARATUS FOR PROCESSING SUBSTRATES

A method for detaching a liquid lamella from a substrate edge is provided. A tear-off front is configured at at least one point of the liquid lamella. A width of the liquid lamella is then reduced by guiding the tear-off front along the substrate edge. Thus, the width of the liquid lamella prior to...

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Bibliographic Details
Main Authors SANDER, Bernd-Uwe, PEDIADITAKIS, Stephan Alexis, HANSEN, Stefan-Heinrich, UIHLEIN, Markus
Format Patent
LanguageEnglish
French
German
Published 11.10.2017
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A method for detaching a liquid lamella from a substrate edge is provided. A tear-off front is configured at at least one point of the liquid lamella. A width of the liquid lamella is then reduced by guiding the tear-off front along the substrate edge. Thus, the width of the liquid lamella prior to being torn off the substrate edge can be reduced by at least 50%, as compared to an original width of the liquid lamella.
Bibliography:Application Number: EP20150831129