PATTERNED CONDUCTIVE EPOXY HEAT-SINK ATTACHMENT IN A MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC)
A monolithic microwave integrated circuit structure having: a semiconductor substrate structure having a plurality of active devices and a microwave transmission line having an input section, an output section and a interconnecting section electrically interconnecting the active devices on one surfa...
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
04.10.2017
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Subjects | |
Online Access | Get full text |
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Summary: | A monolithic microwave integrated circuit structure having: a semiconductor substrate structure having a plurality of active devices and a microwave transmission line having an input section, an output section and a interconnecting section electrically interconnecting the active devices on one surface of the substrate; a thermally conductive, electrically non-conductive heat sink; and a thermally conductive bonding layer for bonding the heat sink to the substrate, the thermally conductive bonding layer having an electrically conductive portion and an electrically non-conductive portion, the electrically conductive portion being disposed between the heat sink and an opposite surface of a portion of the substrate having the active devices and the electrically non-conductive portion being disposed on the opposite surface portion overlaying portion of the microwave transmission line section. |
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Bibliography: | Application Number: EP20150771448 |