METHOD AND DEVICE FOR TREATING THE UNDERSIDE OF A SUBSTRATE

A method for treating the underside of a planar substrate with a treatment medium includes hydrophobizing the underside of the substrate, subsequently forming a protective liquid film on a top side of the substrate and then bringing the treatment medium into contact with the underside of the substra...

Full description

Saved in:
Bibliographic Details
Main Authors SANDER, Bernd-Uwe, PEDIADITAKIS, Stephan Alexis, QUEISSER, Steffen, GANTER, Patrick, WEISE, Katrin
Format Patent
LanguageEnglish
French
German
Published 04.10.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A method for treating the underside of a planar substrate with a treatment medium includes hydrophobizing the underside of the substrate, subsequently forming a protective liquid film on a top side of the substrate and then bringing the treatment medium into contact with the underside of the substrate. In the process, the protective liquid film protects the upper side of the substrate from any action or effect of the treatment medium and/or outgassing. A device for carrying out the method is also provided.
Bibliography:Application Number: EP20150830976