CIRCUIT BOARD WITH CONSTRAINED SOLDER INTERCONNECT PADS
Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a solder mask on a circuit board with a first opening that has a sidewall. A solder interconnect pad is formed in the first opening. The sidewall set...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
06.09.2017
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Subjects | |
Online Access | Get full text |
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Summary: | Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a solder mask on a circuit board with a first opening that has a sidewall. A solder interconnect pad is formed in the first opening. The sidewall sets the lateral extent of the solder interconnect pad. |
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Bibliography: | Application Number: EP20150854911 |