IMAGE SENSOR BENDING BY INDUCED SUBSTRATE SWELLING

A curved image sensor chip has a first side and a second side opposite the first side. The second side includes light sensors configured to generate electrical signals in response to receiving light. A substrate is in contact with the first side of the curved image sensor chip and is configured to i...

Full description

Saved in:
Bibliographic Details
Main Authors VAJO, John J, MCKNIGHT, Geoffrey P, GRAETZ, Jason A
Format Patent
LanguageEnglish
French
German
Published 01.05.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A curved image sensor chip has a first side and a second side opposite the first side. The second side includes light sensors configured to generate electrical signals in response to receiving light. A substrate is in contact with the first side of the curved image sensor chip and is configured to increase in volume so as to apply a bending force to form the curved image sensor chip.
Bibliography:Application Number: EP20150770998