A LEADFRAME AND A METHOD OF MANUFACTURING A LEADFRAME

A method of manufacturing a leadframe, comprising inserting an inlay (306) into an indentation (304) in a base layer (302) to provide a leadframe-material (308), wherein the base layer (302) comprises a first material and the inlay (306) comprises a second material; and forming a leadframe (316) fro...

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Bibliographic Details
Main Authors Chau, On Lok, Ng, To Kam, Ho, Wai Keung
Format Patent
LanguageEnglish
French
German
Published 23.09.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of manufacturing a leadframe, comprising inserting an inlay (306) into an indentation (304) in a base layer (302) to provide a leadframe-material (308), wherein the base layer (302) comprises a first material and the inlay (306) comprises a second material; and forming a leadframe (316) from the leadframe-material (308). The first material comprises one of copper and Alloy 42, and the second material comprises the other of copper and Alloy 42.
Bibliography:Application Number: EP20150201716