PROCESS FOR MANUFACTURING OF A THICK COPPER WIRE FOR BONDING APPLICATIONS

A process for manufacturing a bonding wire containing a core having a surface. The core contains ≧98.0% copper and has a cross sectional area of 75,00 to 600,000 μm2 and an elastic limit RP0.2 (yield strength) of 40 to 95 N/mm2. The process involves (a) providing a copper core precursor; (b) drawing...

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Bibliographic Details
Main Authors MILKE, Eugen, AINOUZ, Larbi, PRENOSIL, Peter
Format Patent
LanguageEnglish
French
German
Published 17.05.2017
Subjects
ALLOYS
BASIC ELECTRIC ELEMENTS
CABLES
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS
CHEMISTRY
CONDUCTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
INSULATORS
METALLURGY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Summary:A process for manufacturing a bonding wire containing a core having a surface. The core contains ≧98.0% copper and has a cross sectional area of 75,00 to 600,000 μm2 and an elastic limit RP0.2 (yield strength) of 40 to 95 N/mm2. The process involves (a) providing a copper core precursor; (b) drawing the precursor until a final diameter of the wire core is reached; and (c) annealing the drawn wire at a minimum annealing temperature of 650 to 1000° C. through its entire cross section for a minimum annealing time of 4 seconds to 2 hours.
Bibliography:Application Number: EP20150721617