STRIP-SHAPED SUBSTRATE FOR PRODUCING CHIP CARRIERS, ELECTRONIC MODULE WITH A CHIP CARRIER OF THIS TYPE, ELECTRONIC DEVICE WITH A MODULE OF THIS TYPE, AND METHOD FOR PRODUCING A SUBSTRATE

A strip-shaped substrate made from a film includes a plurality of units for producing chip carriers. Each unit has a chip island for fixing a semiconductor chip, electrodes for electrical connection of the semiconductor chip, and through-openings for structuring the unit. At least one through-openin...

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Bibliographic Details
Main Authors WALTER, Siegfried, BECKER, Udo, BENEDIKT, Michael, DITZEL, Eckhard
Format Patent
LanguageEnglish
French
German
Published 22.01.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A strip-shaped substrate made from a film includes a plurality of units for producing chip carriers. Each unit has a chip island for fixing a semiconductor chip, electrodes for electrical connection of the semiconductor chip, and through-openings for structuring the unit. At least one through-opening forms an anchoring edge for a casting compound for encapsulating the semiconductor chip. A surface section of the film abutting the through-opening is chamfered to form the anchoring edge. The anchoring edge protrudes past the side of the film on which the chip island is arranged.
Bibliography:Application Number: EP20150729157