METHOD AND APPARATUS FOR DEPOSITING ATOMIC LAYERS ON A SUBSTRATE

• Main Authors: KNAAPEN, Raymond Jacobus Wilhelmus, POODT, Paulus Willibrordus George
• Format: Patent
• Language: English; French; German
• Published: 07.08.2019
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A method of depositing an atomic layer on a substrate comprises supplying a precursor gas from a precursor-gas supply comprised in a drum; the drum being rotatable with respect to a sealing piece that receives gas from a gas source. One of the drum or sealing piece comprising one or more gas gas feed channels in fluid connection with the precursor-gas supply and the other of the drum or sealing piece comprises one or more circumferential grooves in its surface sealed by the one of the drum or sealing piece thereby preventing a fluid flowpath in radial direction and leaving a fluid flow path in circumferential direction. At least one sealed groove is provided with one or more separations separating adjacent zones of process gas feeds in the sealed groove, thus allowing zones to provide for mutually differing process gas compositions to have the precursor gas react near, e.g. on, the substrate thus depositing a stack of atomic layers of a gradient composition.