AIR CAVITY PACKAGE

An air cavity package includes a dielectric frame that is formed from a polyimide or a liquid crystal polymer (LCP). The dielectric frame is joined to a flange and to electrical leads using a polyimide adhesive.

Saved in:
Bibliographic Details
Main Authors NG, Joelle, LEE, Chee Kong, GOH, Wei Chuan, KOBA, Richard J
Format Patent
LanguageEnglish
French
German
Published 18.04.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:An air cavity package includes a dielectric frame that is formed from a polyimide or a liquid crystal polymer (LCP). The dielectric frame is joined to a flange and to electrical leads using a polyimide adhesive.
Bibliography:Application Number: EP20150796186