PROCESS FOR MAKING A MOLDED DEVICE ASSEMBLY AND PRINTHEAD ASSEMBLY

In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit b...

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Bibliographic Details
Main Authors STRAND, Thomas R, GROH, Michael G, CHEN, Chien-Hua
Format Patent
LanguageEnglish
French
German
Published 24.01.2018
Subjects
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Summary:In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.
Bibliography:Application Number: EP20140818797