BONDING WIRE FOR SEMICONDUCTOR DEVICE
There is provided a bonding wire that improves bonding reliability of a ball bonded part and ball formability and is suitable for on-vehicle devices. The bonding wire for a semiconductor includes a Cu alloy core material, and a Pd coating layer formed on a surface of the Cu alloy core material, and...
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| Main Authors | , , |
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| Format | Patent |
| Language | English French German |
| Published |
14.03.2018
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| Subjects | |
| Online Access | Get full text |
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| Abstract | There is provided a bonding wire that improves bonding reliability of a ball bonded part and ball formability and is suitable for on-vehicle devices. The bonding wire for a semiconductor includes a Cu alloy core material, and a Pd coating layer formed on a surface of the Cu alloy core material, and is characterized in that the Cu alloy core material contains Ni, a concentration of Ni is 0.1 to 1.2 wt.% relative to the entire wire, and a thickness of the Pd coating layer is 0.015 to 0.150 µm. |
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| AbstractList | There is provided a bonding wire that improves bonding reliability of a ball bonded part and ball formability and is suitable for on-vehicle devices. The bonding wire for a semiconductor includes a Cu alloy core material, and a Pd coating layer formed on a surface of the Cu alloy core material, and is characterized in that the Cu alloy core material contains Ni, a concentration of Ni is 0.1 to 1.2 wt.% relative to the entire wire, and a thickness of the Pd coating layer is 0.015 to 0.150 µm. |
| Author | UNO Tomohiro OYAMADA Tetsuya DEAI Hiroyuki |
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| DocumentTitleAlternate | VERBINDUNGSDRAHT FÜR HALBLEITERBAUELEMENT CÂBLE DE CONNEXION POUR DISPOSITIF SEMI-CONDUCTEUR |
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| Notes | Application Number: EP20150782477 |
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| PublicationDateYYYYMMDD | 2018-03-14 |
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| PublicationYear | 2018 |
| RelatedCompanies | Nippon Micrometal Corporation Nippon Steel & Sumikin Materials Co., Ltd |
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| Snippet | There is provided a bonding wire that improves bonding reliability of a ball bonded part and ball formability and is suitable for on-vehicle devices. The... |
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| SubjectTerms | ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS METALLURGY SEMICONDUCTOR DEVICES TREATMENT OF ALLOYS OR NON-FERROUS METALS |
| Title | BONDING WIRE FOR SEMICONDUCTOR DEVICE |
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