MOUNTING SUBSTRATE AND ELECTRONIC DEVICE

A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (30); a fine L/S layer (40) formed in contact with a top surface of the wiring substrate; and a plurality of elements (12, 13) arranged in a matrix on a top surface of the fine L/S layer. The wirin...

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Bibliographic Details
Main Author AOYAGI, Akiyoshi
Format Patent
LanguageEnglish
French
German
Published 09.08.2017
Subjects
ADVERTISING
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CRYPTOGRAPHY
DISPLAY
DISPLAYING
EDUCATION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LABELS OR NAME-PLATES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
SEALS
SEMICONDUCTOR DEVICES
SIGNS
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Summary:A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (30); a fine L/S layer (40) formed in contact with a top surface of the wiring substrate; and a plurality of elements (12, 13) arranged in a matrix on a top surface of the fine L/S layer. The wiring substrate includes a plurality of first wiring lines (SigB1, Gate2), and a plurality of vias (14) arranged at a period corresponding to an integral multiple of an arrangement period of the plurality of element, and two or more of the vias are provided for each of the first wiring lines. Two or more adjacent ones of the elements on the fine L/S layer are electrically coupled to common one of the vias through one or more second wiring lines (16).
Bibliography:Application Number: EP20150773964