MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODE

A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include...

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Bibliographic Details
Main Authors GOLDA, Dariusz, BIBL, Andreas
Format Patent
LanguageEnglish
French
German
Published 31.01.2018
Subjects
BASIC ELECTRIC ELEMENTS
CONVEYING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
MICROSTRUCTURAL TECHNOLOGY
PACKING
PERFORMING OPERATIONS
PNEUMATIC TUBE CONVEYORS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
SHOP CONVEYOR SYSTEMS
STORING
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING
TRANSPORTING
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Summary:A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure
Bibliography:Application Number: EP20160188068