APPARATUS AND METHOD OF CUTTING A LAMINATED, ULTRA-THIN GLASS LAYER

A method and a device for cutting a laminate including at least one glass layer with a thickness less than or equal to 0.3 mm and including at least one polymeric layer are disclosed. The method includes generating a surface scratch on a first surface of the glass layer, wherein the scratch, startin...

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Bibliographic Details
Main Author YEH, Li-Ya
Format Patent
LanguageEnglish
French
German
Published 18.05.2022
Subjects
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
GLASS
MACHINE TOOLS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
MINERAL OR SLAG WOOL
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A method and a device for cutting a laminate including at least one glass layer with a thickness less than or equal to 0.3 mm and including at least one polymeric layer are disclosed. The method includes generating a surface scratch on a first surface of the glass layer, wherein the scratch, starting from a lateral edge, extends along a cutting line. The method further includes moving a first laser beam, starting from the scratch, across the first surface along the cutting line. The method also includes cooling the glass layer along the cutting line, wherein the glass layer breaks along the cutting line The polymeric layer is severed by moving a second laser beam along the cutting line. The device includes means for cutting the laminate according to the disclosed method.
Bibliography:Application Number: EP20150700249