HEAT SPREADER IN MULTILAYER BUILD UPS
Connection system (1) for electronic components, the connection system (1) comprising at least one electrically insulating layer (4a', 4a", 4b', 4b") and at least one electrically conductive layer (3a, 6a, 3b, 6b), wherein the connection system (1) further comprises a heat distri...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
04.01.2017
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Subjects | |
Online Access | Get full text |
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Summary: | Connection system (1) for electronic components, the connection system (1) comprising at least one electrically insulating layer (4a', 4a", 4b', 4b") and at least one electrically conductive layer (3a, 6a, 3b, 6b), wherein the connection system (1) further comprises a heat distributing layer (5a, 5b) arranged within the at least one electrically insulating layer (4a', 4a", 4b', 4b"), wherein the at least one heat distributing layer (5a, 5b) is made of thermally conductive, and electrically insulating, matrix-free material. |
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Bibliography: | Application Number: EP20150707148 |