COOLING METHOD FOR A VEHICLE COMPONENT, COOLING APPARATUS AND VEHICLE

• Main Author: MEITINGER, Karl-Heinz
• Format: Patent
• Language: English; French; German
• Published: 21.12.2016
• Subjects: ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS INVEHICLES; ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OFTRANSMISSIONS IN VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GASEXHAUST OR FUEL SUPPLY OF PROPULSION UNITS, IN VEHICLES; ARRANGEMENTS OR ADAPTATIONS OF HEATING, COOLING, VENTILATING,OR OTHER AIR-TREATING DEVICES SPECIALLY FOR PASSENGER OR GOODSSPACES OF VEHICLES; AUXILIARY DRIVES FOR VEHICLES; BASIC ELECTRIC ELEMENTS; BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COOLING OF INTERNAL-COMBUSTION ENGINES; COOLING OF MACHINES OR ENGINES IN GENERAL; ELECTRIC EQUIPMENT OR PROPULSION OF ELECTRICALLY-PROPELLEDVEHICLES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES, IN GENERAL; ENGINE PLANTS IN GENERAL; HEATING; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; LIGHTING; MACHINES OR ENGINES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; STEAM ENGINES; TRANSPORTING; VEHICLES IN GENERAL; WEAPONS

In a method for cooling a component of a motor vehicle, which component is coupled thermally to a cooling volume filled with a liquid coolant, at least one cooling parameter is measured by a control device and, in dependence on the cooling parameter, the component is either cooled in a first cooling mode, in which the cooling volume is connected via a first and second coupling device to a cooling circuit which includes at least one circulating device by means of which the coolant is circulated, or is cooled in a second cooling mode, in which the cooling volume is separated from the cooling circuit by the first and second coupling device, wherein the component is cooled by evaporation of coolant in the cooling volume.