PHYSICAL VAPOR DEPOSITION USING ROTATIONAL SPEED SELECTED WITH RESPECT TO DEPOSITION RATE

• Main Authors: LITTON, David A, BEERS, Russell, A, DEPALMA, Joseph A, HAZEL, Brian T, MALONEY, Michael, NEAL, James W, TRUBELJA, Mladen F, COTNOIR, Glenn A
• Format: Patent
• Language: English; French; German
• Published: 14.10.2020
• Subjects: BLASTING; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ENGINE PLANTS IN GENERAL; HEATING; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; LIGHTING; MACHINES OR ENGINES IN GENERAL; MECHANICAL ENGINEERING; METALLURGY; NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES; STEAM ENGINES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; WEAPONS

A method for use in a physical vapor deposition coating process includes depositing a ceramic coating material (26) from a plume (42) onto at least one substrate (32) to form a ceramic coating (54) thereon, and during the deposition, rotating the at least one substrate (32) at a rotational speed selected with respect to deposition rate of the ceramic coating material (26) onto the at least one substrate (32).