BARRIER FILMS AND VACUUM INSULATED PANELS EMPLOYING SAME

There is provided a vacuum insulation panel envelope having a substrate, a low thermal conductivity organic layer and a low thermal conductivity inorganic stack. The low thermal conductivity inorganic stack will include low thermal conductivity non-metallic inorganic materials and/or low thermal con...

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Bibliographic Details
Main Authors BANGE, DONNA W, YU, TA-HUA, PIEPER, JOSEPH M, LYONS, CHRISTOPHER S, BEDOYA, CEDRIC, HOGERTON, PETER B, ENGEN, PAUL T, MCCLURE, DONALD J, PRESZLER PRINCE, AMY, NIE, QIHONG
Format Patent
LanguageEnglish
French
German
Published 26.10.2016
Subjects
BUILDING
CEILINGS
FIXED CONSTRUCTIONS
FLOORS
GENERAL BUILDING CONSTRUCTIONS
INSULATION OR OTHER PROTECTION OF BUILDINGS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
ROOFS
TRANSPORTING
WALLS, e.g. PARTITIONS
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Summary:There is provided a vacuum insulation panel envelope having a substrate, a low thermal conductivity organic layer and a low thermal conductivity inorganic stack. The low thermal conductivity inorganic stack will include low thermal conductivity non-metallic inorganic materials and/or low thermal conductivity metallic materials.
Bibliography:Application Number: EP20140824296