COPPER ALLOY AND COPPER ALLOY SHEET

Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17‰¤f1=[Zn]+5×[Sn]-2×[Ni]‰¤30, 14‰¤f2=[2n]-0.5...

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Bibliographic Details
Main Authors OISHI Keiichiro, HOKAZONO Takashi, NAKASATO Yosuke
Format Patent
LanguageEnglish
French
German
Published 20.03.2019
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Summary:Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17‰¤f1=[Zn]+5×[Sn]-2×[Ni]‰¤30, 14‰¤f2=[2n]-0.5×[Sn]-3×[Ni]‰¤26, 8‰¤f3={f1×(32-f1)} 1/2 ×[Ni]‰¤23, 1.3‰¤[Ni]+[Sn]‰¤2.4, 1.5‰¤[Ni]/[Sn]‰¤5.5, and 20‰¤[Ni]/[P]‰¤400 are satisfied. The copper alloy has a metallographic structure of an ± single phase.
Bibliography:Application Number: EP20140849687