COPPER ALLOY AND COPPER ALLOY SHEET
Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17¤f1=[Zn]+5×[Sn]-2×[Ni]¤30, 14¤f2=[2n]-0.5...
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
20.03.2019
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Subjects | |
Online Access | Get full text |
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Summary: | Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17¤f1=[Zn]+5×[Sn]-2×[Ni]¤30, 14¤f2=[2n]-0.5×[Sn]-3×[Ni]¤26, 8¤f3={f1×(32-f1)} 1/2 ×[Ni]¤23, 1.3¤[Ni]+[Sn]¤2.4, 1.5¤[Ni]/[Sn]¤5.5, and 20¤[Ni]/[P]¤400 are satisfied. The copper alloy has a metallographic structure of an ± single phase. |
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Bibliography: | Application Number: EP20140849687 |