Bi GROUP SOLDER ALLOY, METHOD FOR BONDING ELECTRONIC PART USING SAME, AND ELECTRONIC PART MOUNTING SUBSTRATE

• Main Author: NAGATA Hiroaki
• Format: Patent
• Language: English; French; German
• Published: 17.05.2017
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

Provided is a Bi-based solder alloy containing a specific amount of Al in Bi-Ag and having particles including a Ag-Al intermetallic compound dispersed therein, a method of bonding a Ag-plated electronic component, a bare Cu frame electronic component, an Ni-plated electronic component, or the like using the same, and an electronic component-mounted board. A Bi-based solder alloy includes Ag and Al, is substantially free of Pb, and has a Bi content of 80 mass% or more, a solidus of a melting point of 265°C or more, and a liquidus of 390°C or less. A content of Ag is 0.6 to 18 mass%, a content of Al is 0.1 to 3 mass%, the content of Al is 1/20 to 1/2 of the content of Ag, and particles including a Ag-Al intermetallic compound are dispersed in the solder alloy.