SILICON-BASED REPAIR METHODS AND COMPOSITION

There is set forth herein a silicon-based patch formulation comprising about 25 to 66 percent by volume of a solvent; about 4 to 10 percent by volume of a silicon-comprising binding material; and about 30 to 65 percent by volume of a patching material, the patching material comprising particles havi...

Full description

Saved in:
Bibliographic Details
Main Authors POERSCHKE, David, ANTOLINO, Nicholas Edward, MCEVOY, Kevin Paul, LIPKIN, Don Mark
Format Patent
LanguageEnglish
French
German
Published 15.05.2019
Subjects
ADHESIVES
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
CORRECTING FLUIDS
DYES
FILLING PASTES
INKS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PERFORMING OPERATIONS
POLISHES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
USE OF MATERIALS THEREFOR
WOODSTAINS
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online AccessGet full text

Cover

More Information
Summary:There is set forth herein a silicon-based patch formulation comprising about 25 to 66 percent by volume of a solvent; about 4 to 10 percent by volume of a silicon-comprising binding material; and about 30 to 65 percent by volume of a patching material, the patching material comprising particles having one or more non-actinide Group IIIA elements, wherein a molar ratio of the one or more non-actinide Group IIIA elements to silicon within the patch formulation is about 0.95 to 1.25.
Bibliography:Application Number: EP20150201549