CLEANING FLUX, CLEANING SOLDER PASTE, AND USE TO FORM A SOLDER JOINT

• Main Authors: MARUKO Daisuke, KOJIMA Naokatsu
• Format: Patent
• Language: English; French; German
• Published: 08.08.2018
• Subjects: CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; COMPOSITIONS BASED THEREON; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A purpose is to provide a cleaning flux that does not inhibit a function for removing a metal oxide film but suppresses volatilization by heating during soldering. The cleaning flux contains as a solvent 60-98% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine wherein an addition amount of the alkylene oxide-resorcinol copolymer is within a range of 0-98% by weight and the addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the range of 0-98% by weight; and further one or both of an organic acid and a halogen compound wherein the addition amount of the organic acid is within the range of 0-18% by weight and the addition amount of the halogen compound is within the range of 0-4% by weight.