ELECTRONIC PACKAGES AND METHODS OF MAKING AND USING THE SAME

An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer (102) and a conformal masking layer (112) disposed on at least a portion of the dielectric layer (102). The electronic package further includes a routing layer (136) disposed on at l...

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Bibliographic Details
Main Authors FORMAN, GLENN ALAN, KAPUSTA, CHRISTOPHER JAMES, DAVIS, ERIC PATRICK, SMITH, SCOTT
Format Patent
LanguageEnglish
French
German
Published 08.06.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer (102) and a conformal masking layer (112) disposed on at least a portion of the dielectric layer (102). The electronic package further includes a routing layer (136) disposed on at least a portion of the combined masking layer (112) and a micro-via (122) disposed at least in part in the conformal masking layer (112) and the routing layer (136). Further, at least a portion of the routing layer (136) forms a conformal electrically conductive layer (130) in at least a portion of the micro-via (122). Also, the conformal masking layer (112) is configured to define a size of the micro-via (122). The electronic package further includes a semiconductor die (118) operatively coupled to the micro-via (122).
Bibliography:Application Number: EP20150195705