RELEASE FILMS VIA SOLVENTLESS EXTRUSION PROCESSES
Described herein are release layers formed via solventless extrusion. The release layers include a polyolefin and an alkyl dimethicone. The release layers exhibit tailorable release properties from pressure-sensitive adhesives. The release layers are simple to make and require no post-treatment in o...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English French German |
Published |
25.08.2021
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Subjects | |
Online Access | Get full text |
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Summary: | Described herein are release layers formed via solventless extrusion. The release layers include a polyolefin and an alkyl dimethicone. The release layers exhibit tailorable release properties from pressure-sensitive adhesives. The release layers are simple to make and require no post-treatment in order to impart the observed release properties. The release layers are adaptable to multilayer extrusion, blown film formation, and cast film formation techniques. |
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Bibliography: | Application Number: EP20140831748 |