BIOFILM RESISTANT MEDICAL IMPLANT

A method of incorporating silver and/or copper into a biomedical implant includes: providing an implant having an outer surface; depositing silver and/or copper onto the outer surface of the implant; diffusing the silver and/or copper into a subsurface zone adjacent the outer surface; and oxidizing...

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Bibliographic Details
Main Authors WEAVER, Carolyn, PAWAR, Vivek, D, ROSE, John
Format Patent
LanguageEnglish
French
German
Published 05.04.2017
Subjects
CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS, ORSURGICAL ARTICLES
DISINFECTION, STERILISATION, OR DEODORISATION OF AIR
HUMAN NECESSITIES
HYGIENE
MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICALARTICLES
MEDICAL OR VETERINARY SCIENCE
METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS INGENERAL
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Summary:A method of incorporating silver and/or copper into a biomedical implant includes: providing an implant having an outer surface; depositing silver and/or copper onto the outer surface of the implant; diffusing the silver and/or copper into a subsurface zone adjacent the outer surface; and oxidizing or anodizing the implant after the diffusion step to form an oxidized or anodized layer that contains at least some amount of elemental silver, elemental copper or silver or copper ions or compounds.
Bibliography:Application Number: EP20140830097