POWER SEMICONDUCTOR MODULE

Provided is a power semiconductor module wherein stress generated at a soldering section of a relay terminal is relaxed. A power semiconductor module (1) is provided with a substrate (2), relay terminals (9, 10), external connecting terminals (13, 14), and a relay terminal holding member (6). The re...

Full description

Saved in:
Bibliographic Details
Main Authors KOKUBUN, SHUICHI, HARADA, TSUYOSHI, YAMADA, TAKESHI, WATARI, SHINJIRO
Format Patent
LanguageEnglish
French
German
Published 18.05.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Provided is a power semiconductor module wherein stress generated at a soldering section of a relay terminal is relaxed. A power semiconductor module (1) is provided with a substrate (2), relay terminals (9, 10), external connecting terminals (13, 14), and a relay terminal holding member (6). The relay terminals (9, 10) are connected to the substrate (2) with a solder (4) therebetween. The external connecting terminals (13, 14) are bonded to the relay terminals (9, 10), respectively. The non-conductive relay terminal holding member (6) holds end portions of the relay terminals (9, 10), said end portions being on the side bonded to the solder (4).
Bibliography:Application Number: EP20140822617