CHIP CARD AND METHOD FOR PRODUCING A CHIP CARD

According to various embodiments, a chip card (100) can comprise: an electronic chip module (106); a chip card housing (102); and an adhesive layer (104) for bonding the chip module (106) with the chip card housing (102), wherein the adhesive layer (104) can comprise an isocyanate-based reactive adh...

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Bibliographic Details
Main Authors KNEBEL, Michael, SPOETTL, Thomas, STAMPKA, Peter, KRUEGER, Per
Format Patent
LanguageEnglish
French
German
Published 13.02.2019
Subjects
Online AccessGet full text

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Summary:According to various embodiments, a chip card (100) can comprise: an electronic chip module (106); a chip card housing (102); and an adhesive layer (104) for bonding the chip module (106) with the chip card housing (102), wherein the adhesive layer (104) can comprise an isocyanate-based reactive adhesive, the reactive adhesive further comprising a hot adhesive component.
Bibliography:Application Number: EP20140733571