INTEGRATING MULTI-OUTPUT POWER CONVERTERS HAVING VERTICALLY STACKED SEMICONDUCTOR CHIPS
A electronic multi-output device having a substrate including a pad and pins. A composite first chip has a first and a second transistor integrated so that the first terminals of the transistors are merged into a common terminal on one chip surface. Patterned second and third terminals are on the op...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
30.11.2022
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Subjects | |
Online Access | Get full text |
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Abstract | A electronic multi-output device having a substrate including a pad and pins. A composite first chip has a first and a second transistor integrated so that the first terminals of the transistors are merged into a common terminal on one chip surface. Patterned second and third terminals are on the opposite chip surface. The common first terminal is attached to the substrate pad. The second terminals are connected by discrete first and second metal clips to respective substrate pins. A composite second chip has a third and a fourth transistor integrated so that the second terminals of the transistors are merged into a common terminal on one chip surface. Patterned first and third terminals are on the opposite chip surface. The second chip is flipped to be vertically attached with its first terminals to the first and second clips, respectively. The third terminals are connected by discrete clips to respective substrate pins. The common second terminal is connected by a common clip to a substrate pin. |
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AbstractList | A electronic multi-output device having a substrate including a pad and pins. A composite first chip has a first and a second transistor integrated so that the first terminals of the transistors are merged into a common terminal on one chip surface. Patterned second and third terminals are on the opposite chip surface. The common first terminal is attached to the substrate pad. The second terminals are connected by discrete first and second metal clips to respective substrate pins. A composite second chip has a third and a fourth transistor integrated so that the second terminals of the transistors are merged into a common terminal on one chip surface. Patterned first and third terminals are on the opposite chip surface. The second chip is flipped to be vertically attached with its first terminals to the first and second clips, respectively. The third terminals are connected by discrete clips to respective substrate pins. The common second terminal is connected by a common clip to a substrate pin. |
Author | HERBSOMMER, Juan, Alejandro DENISON, Marie LOPEZ, Osvaldo, Jorge CARPENTER, Brian, Ashley NOQUIL, Jonathan |
Author_xml | – fullname: NOQUIL, Jonathan – fullname: DENISON, Marie – fullname: HERBSOMMER, Juan, Alejandro – fullname: LOPEZ, Osvaldo, Jorge – fullname: CARPENTER, Brian, Ashley |
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DocumentTitleAlternate | INTÉGRATION DE CONVERTISSEURS DE PUISSANCE À PLUSIEURS SORTIES SUR LESQUELS DES PUCES SEMI-CONDUCTRICES SONT EMPILÉES VERTICALEMENT INTEGRATION VON LEISTUNGSWANDLERN MIT MEHREREN AUSGÄNGEN UND VERTIKAL GESTAPELTEN HALBLEITERCHIPS |
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Notes | Application Number: EP20140782292 |
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RelatedCompanies | Texas Instruments Incorporated |
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Snippet | A electronic multi-output device having a substrate including a pad and pins. A composite first chip has a first and a second transistor integrated so that the... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | INTEGRATING MULTI-OUTPUT POWER CONVERTERS HAVING VERTICALLY STACKED SEMICONDUCTOR CHIPS |
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