INTEGRATING MULTI-OUTPUT POWER CONVERTERS HAVING VERTICALLY STACKED SEMICONDUCTOR CHIPS

• Main Authors: NOQUIL, Jonathan, DENISON, Marie, HERBSOMMER, Juan, Alejandro, LOPEZ, Osvaldo, Jorge, CARPENTER, Brian, Ashley
• Format: Patent
• Language: English; French; German
• Published: 30.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A electronic multi-output device having a substrate including a pad and pins. A composite first chip has a first and a second transistor integrated so that the first terminals of the transistors are merged into a common terminal on one chip surface. Patterned second and third terminals are on the opposite chip surface. The common first terminal is attached to the substrate pad. The second terminals are connected by discrete first and second metal clips to respective substrate pins. A composite second chip has a third and a fourth transistor integrated so that the second terminals of the transistors are merged into a common terminal on one chip surface. Patterned first and third terminals are on the opposite chip surface. The second chip is flipped to be vertically attached with its first terminals to the first and second clips, respectively. The third terminals are connected by discrete clips to respective substrate pins. The common second terminal is connected by a common clip to a substrate pin.