COOLING SYSTEM FOR USE WITH A POWER ELECTRONICS ASSEMBLY AND METHOD OF MANUFACTURING THEREOF

A cooling system (206) for use with a power electronics assembly (200) comprising an array (202) of line-replaceable units (204) is provided. The cooling system (206) includes a first manifold (210) coupled in flow communication with the array (202) of line-replaceable units (204), and a fluid suppl...

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Bibliographic Details
Main Author KUSUDA, Charles E
Format Patent
LanguageEnglish
French
German
Published 04.11.2020
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMBINED OPERATIONS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
UNIVERSAL MACHINE TOOLS
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Summary:A cooling system (206) for use with a power electronics assembly (200) comprising an array (202) of line-replaceable units (204) is provided. The cooling system (206) includes a first manifold (210) coupled in flow communication with the array (202) of line-replaceable units (204), and a fluid supply (208) coupled in flow communication with the first manifold (210). The fluid supply (208) is configured to channel cooling fluid towards the first manifold (210) such that the cooling fluid (208) is discharged towards the line-replaceable units (204) in the array (202) substantially simultaneously.
Bibliography:Application Number: EP20150186925