METHOD FOR MANUFACTURING A COMPONENT-EMBEDDED SUBSTRATE, AND A COMPONENT-EMBEDDED SUBSTRATE

In a method for manufacturing a device embedded substrate (20), a conductive via (16) that penetrates a first insulating layer (5) and a second insulating layer (11) from an outer metal layer (14) to reach a second terminal (4b) of an IC device (4) is formed after forming the outer metal layer (14).

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Bibliographic Details
Main Authors MATSUMOTO, Tohru, TODA, Mitsuaki, MURATA, Seiko
Format Patent
LanguageEnglish
French
German
Published 08.07.2020
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:In a method for manufacturing a device embedded substrate (20), a conductive via (16) that penetrates a first insulating layer (5) and a second insulating layer (11) from an outer metal layer (14) to reach a second terminal (4b) of an IC device (4) is formed after forming the outer metal layer (14).
Bibliography:Application Number: EP20130884904