LIGHT-EMITTING DEVICE PACKAGE, MANUFACTURING METHOD THEREOF, AND VEHICLE LAMP AND BACKLIGHT UNIT INCLUDING SAME

Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for cov...

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Bibliographic Details
Main Authors JUNG, SEOUNG HO, JUNG, JUNG HWA, HWANG, SUNG KI
Format Patent
LanguageEnglish
French
German
Published 23.11.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.
Bibliography:Application Number: EP20140797634