OPTICAL MODULE HEAT DISSIPATING SYSTEM

• Main Authors: HAO, Mingliang, HUANG, Shuliang, LIU, Zaomeng
• Format: Patent
• Language: English; French; German
• Published: 14.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DEVICES USING STIMULATED EMISSION; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

Embodiments of the present invention relate to communication fittings technologies, and provide a heat dissipation system for an optical module, to improve heat dissipation efficiency of the optical module. In the embodiments of the present invention, the heat dissipation system for an optical modul...