OPTICAL MODULE HEAT DISSIPATING SYSTEM

Embodiments of the present invention relate to communication fittings technologies, and provide a heat dissipation system for an optical module, to improve heat dissipation efficiency of the optical module. In the embodiments of the present invention, the heat dissipation system for an optical modul...

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Bibliographic Details
Main Authors HAO, Mingliang, HUANG, Shuliang, LIU, Zaomeng
Format Patent
LanguageEnglish
French
German
Published 14.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
DEVICES USING STIMULATED EMISSION
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Embodiments of the present invention relate to communication fittings technologies, and provide a heat dissipation system for an optical module, to improve heat dissipation efficiency of the optical module. In the embodiments of the present invention, the heat dissipation system for an optical module includes a circuit card on which at least one optical module is mounted, where the optical module includes a housing and a laser disposed inside the housing; a first heat dissipation apparatus is fixedly disposed on the circuit card; a heat dissipation window is provided in an area that is above the laser and on the housing of the optical module; and the first heat dissipation apparatus performs heat dissipation on the heat dissipation window. The present invention is mainly applied to the communications field.
Bibliography:Application Number: EP20130885076