HEAT RESISTANT POLYAMIDE COMPOSITIONS

Disclosed are heat resistant polyamide compositions including a) one or more polyamide resins, b) one or more reinforcing agents, c) a zinc compound; d) a copper heat stabilizer; and optionally, e) a polyhydric alcohol.

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Bibliographic Details
Main Authors DUNCAN, Andrew, Jay, THOMPSON, Jennifer, Leigh, MESSMORE, Benjamin, Weaver
Format Patent
LanguageEnglish
French
German
Published 24.02.2021
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:Disclosed are heat resistant polyamide compositions including a) one or more polyamide resins, b) one or more reinforcing agents, c) a zinc compound; d) a copper heat stabilizer; and optionally, e) a polyhydric alcohol.
Bibliography:Application Number: EP20140715196