POLISHING PAD AND POLISHING METHOD

The present invention provides a polishing pad including a polishing member having a polishing surface, wherein the polishing member contains a material having dilatancy characteristics.

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Bibliographic Details
Main Authors KASHIWADA, Hiroshi, DOI, Toshiro, TAKAGI, Masataka, SESHIMO, Kiyoshi
Format Patent
LanguageEnglish
French
German
Published 19.06.2019
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:The present invention provides a polishing pad including a polishing member having a polishing surface, wherein the polishing member contains a material having dilatancy characteristics.
Bibliography:Application Number: EP20140762618